LEP wafer handling robots offer the highest performance and accuracy in the smallest package. Utilizing 'tried and true' features in a highly evolved design, the LEP robot provides very high reliability and throughput. All critical components are machined on state-of-the-art machining centers at LEP's own New York based machine shop. The over-under transfer scheme permits wafer handling within a very small envelope and minimizing wafer exchange time.
The low height and surface mount of this robot enable system design to utilize more space around the robot for integration of electronics, instrumentation and other automation. No other robot gives you this design freedom.
Best of all, the robot offers a very simplified sturdy design allowing it to be easily field repairable or replaced within minutes. Most axes utilize the same controller board which may be replaced by a simple DIP switch address change.
Stages
The patented anti-migration devices on the Ludl Electronic Products stage eliminate bearing cage migration, which means increased uptime and fewer service calls. Precision and repeatability is assured by the use of high resolution rotary encoders mounted to the leadscrew shaft. Zero backlash recirculating ball leadscrews ensure high accuracy and long life.
Each LEP stage is manufactured individually in New York to mate perfectly with the chosen inspection microscope. High-speed DC servos coupled with Microtronic SITEview™ software ensures smooth operation, highest throughput and extremely high accuracy. Also available are high precision grid encoded stages, ideal for high-accuracy review applications.
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LEP 300mm Wafer Handling Robot |
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LEP 8" X 8" Stage |
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LEP 8" X 8" High Accuracy Stage |
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LEP 12" X 12" High Accuracy Stage |
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LEP Large Format Stages for FPDs |
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