Spin Defect on the edge of the semiconductor wafer is a coater issue that effects the semiconductor wafer edge. A defect appearing on the edge of the semiconductor wafer is typically due to lack of resist volume to sufficiently coat the entire wafer. This type of defect can also be caused by other process problems including topography process problems.
Here is another good example of this defect appearing on the edge of the Semiconductor wafer.
Another defect example on the edge of a semiconductor wafer. Note that in some instances, there may be only a single spin defect on a wafer.
Spin Defect on Edge
Spin Defect on Edge
Spin Defect on the edge of the semiconductor wafer is a coater issue that effects the semiconductor wafer edge. A defect appearing on the edge of the semiconductor wafer is typically due to lack of resist volume to sufficiently coat the entire wafer. This type of defect can also be caused by other process problems including topography process problems.
Here is another good example of this defect appearing on the edge of the Semiconductor wafer.
Another defect example on the edge of a semiconductor wafer. Note that in some instances, there may be only a single spin defect on a wafer.
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Gallery of Macro Defects Detected By EAGLEview
Reticle Tilt Defect
Spin Defect – Line
Spin Defect – Entire Wafer
Spin Defect on Edge
Center Spin Macro Defect
Scratches By Machine
Scratches By Human
Rework – Yield Improvement
Rework – Scrap Avoidance
Previous Layer Defects
Partial Pattern – No Expose
Poly Haze Macro Defect
Particle Defects
Missing Patterns
Lens Stepper Macro Defects
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